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The cooling mechanism is very crucial to ensure the rated performance of CPU, at the same time it accounts for the major operating cost of the system. Therefore, an efficient electronics cooling is necessary to provide the continuous operations at low operating costs. Tools of computational Fluid Dynamics are widely being used to optimize the cooling mechanism of the chips. In this study the focus is on finding the optimum heat sink design for electronics cooling.

The project shows how to use FEA to accurately predict the performance of a thermal shipper pack.

FEA thermal simulation on an electronic enclosure design purely through conduction

Thermal comfort of a child within a stroller at different configurations.

thermal analysis | SimScale Project Library | Page 3