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CFD Cooling electronics inside of cabinet

This project deals with simulating the flow through the graphic card at different fan Rpms using the Multiple reference frame(MRF) rotational zone concept. A conjugate heat transfer analysis will be performed to keep a check on thermal throttling of the GPU.

The goal of this project is to simulate the simplified version of the cooling system of the HP Workstation Notebook.
This is a Conjugate Heat Transfer (CHT) problem. Incompressible turbulent flow was assigned for the air flow. Two cooling scenarios are going to be investigated
1- Current cooling system 
2- External cooling fan assisted system

The presented project is an analysis of the thermal performance of a heat sink connected to chip. The chip acts as a power source generating 30W of heat. Using a conjugate heat transfer analysis allows for simulation of heat transfer between the solids via conduction and the dissipation of heat into the ambient fluid via convection. The components are cooled passively and buoyancy effects  drive the flow in the surrounding air.

The objective of this project is to evaluate the max temperature of the chip during operation and therefore a steady state analysis was carried out.

Comparing a coupe of LED designs - can we improve the efficiency without adding active cooling.

The cooling of a dense packaging of electronics (about 100W) inside an enclosure is simulated.

Automotive high heat generation power electronics cooling

used to solve the high heat flux problems in electronics cooling.

For this project the thermal performance of internal components of a drone are analysed using a conjugate heat transfer CFD simulation. The internal space is cooled using a simplified fan and results are used to judge whether the fan flow rate is sufficient for the given power output of the electrical components.

The cooling mechanism is very crucial to ensure the rated performance of CPU, at the same time it accounts for the major operating cost of the system. Therefore, an efficient electronics cooling is necessary to provide the continuous operations at low operating costs. Tools of computational Fluid Dynamics are widely being used to optimize the cooling mechanism of the chips. In this study the focus is on finding the optimum heat sink design for electronics cooling.

Design of a cast aluminum heatsink for a 100W computer CPU

Passive and Active convection cooling of a Raspberry Pi mother board design .

analysis of heat distribution in an e3d-v6 hot-end

This project shows an electronic cooling application of ICs on PCB using the conjugate heat transfer transfer technique, abbreviated as CHT. Conjugate heat transfer defines processes which involve variations of temperature within solids and fluids due to thermal interaction.
You can find the tutorial for this project here: https://www.simscale.com/docs/tutorials/conjugate-heat-transfer-cooling-of-electronic-sink/

This project analysis the cooling of a PCB board via CHT

CHT simulation of heat sink with temperature source

electronics cooling | SimScale Project Library | Page 2