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Brak wentylacji, 134 diody (67 w symetrii) każda po 1W mocy. PCB ze zmienionym przewodnictwem ciepła.

To evaluate different Heatsink mounting orientations.

Internal Natural Convection Electronics Cooling Demo 2

Demo of cooling of Raspberry Pi using the Immersed Boundary Method (IBM). 
IBM makes CAD cleanup and defeaturing obsolete. A CAD with detailed electronic features (pins, connectors, engravings, etc.) can be directly imported as is for simulation
In this demo a Raspberry Pi is overclocked and the heat transfer behaviour is compared for two cases where the fan is off and on.

Demonstration project of an electronics enclosure using CHT v2. Comparison different passive heat sink designs and comparison of active and passive cooling

LED Spotlight project, aiming to bring the temperature of the diodes of an LED spotlight design below the maximum allowed temperature of the diodes of 90C. Comparison of different heat sink designs

natural convection cooling of a thermoelectric generator setup with heatplate including radiation

Electronics packaging with forced cooling. Find the best location for the fan, outlet ventilation locations etc.

Thermal analysis of cooling system for solar panels

Aim to show electronics cooling and airflow inside a Stewart platform.

Carry out conjugate heat transfer analysis with 2021 battery segment including busbars. The goal is to find the size the fan by finding the right air flow rate to keep cell temperature in check

Thermal analysis of an active heatsink to cool a microprocessor

Testing out a CPU cooler with a copper Vapor Chamber and Copper HeatSink

Thermal simulation of electronics in a housing.

This project simulates a solid-state relay under a 15W heat load. 
This relay includes a heat sink that acts as a fixture from the relay housing to the mounting wall. The product is tested under natural convection conditions at 20C. 

Credits to Xinchao Song for the 3D model used in this project.  Link : https://tinyurl.com/ycd6cvug

To impart cooling to the electronic components

Calculate the Fin thickness and heat dissipation

Calculate the area and Fin thickness required heat dissipation

Conjugate heat transfer simulation to analyse the thermal performance of water cooled transistors.

This simulation aims a determining whether the temperature of the board of 2x 160W COB Series UV LED is below the recommended temperature of 40C  with a water cooling block running with 0.2m/s inlet velocity.

3D model from Philippe Cavalier (https://grabcad.com/library/water-cooling-led-heatsink-1)

Enclosure for an industrial application of a GPU on the edge, cooled via an active fan from the top.

LED Spotlight project, aiming a bring the temperature of the diodes of a LED spotlight design below the maximum allowed temperature of 100C.

Heat transfer simulation of a cooling plate to determine the resulting temperature and heat flux distribution. This project is carried out for the partial fulfillment  of Homework Session of the FEA in Formula Student and Formula SAE Workshop.
Water is circulated through the water jackets inside the plates for the water convection purpose  also convection of air acts on the outer surfaces of the plates.

Setup of Heatsink Simulation for comparison to fusion electronic cooling.

Electric panel-cabinet cooling analysis via CHT

Simulation of led pcb heat sink
thermal description
led thermal management system

electronics cooling | SimScale Project Library | Page 1